Semiconductor packaging

Providing first class packaging and housing

Aptasic - Semiconductor Packaging

Semiconductor packaging

Aptasic - Our Solutions - Semiconductor Packaging

Aptasic offers a large panel of packaging solutions from low volume to mass production. Including, from bare die assembly (as WLCSP) , through open cavity packages to high volume QFN.

Packages for Prototyping

Open package families
Plastic open cavity packages: DFN, QFN, TQFP, LQFP, SOICN, SOIC-W, SSOP

Packages for Mass Production

Laminate substrate packages
JLCC, LCC, LDCC, QFP, PDIP, PGA, TO, SOIC

Discrete package families
SOT-23, SOTI43, SC70, TSOT, SOT666, SOT223, TO-92, SOT89, SOT323

Ceramic packages
JLCC, LCC, LDCC, QFP, PDIP, PGA, TO, SOIC

Standard package families
Lead-less packages: DFN, QFN Leaded packages: QFP, TQFP, LQFP, MSOP, QSOP, SOICN, SOIC-W, TSSOP-4.4, TSSOP-6.1, SSOP PDIP, PLCC

Specific packages
TO-220, DDPACK, Clear pkgs, PSOP

Multi die packages
Stacked, Flip, chipped, Multi chips System in Package (SIP) wiht Chips and passive components. Package on / in package

Wafer Level Chip Scale (WLCS)

Specific custom package development

Wafer Level Package

Wafer Level Test

Back-end and conditioning

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