Equipment
We have the equipment you need
Equipment
Total of 1400m2 with 400m2 Clean Room “Class 10’000”
Our services are supported by modern and flexible equipment:
- Test program development: analog/mixed signal (AMS), digital scan test, memory BIST, radio frequency (RF)
- Multi-site wafer probing at cold/room/hot temperature (-40C° / 125-200C°)
- Parallel package test at cold / room / hot temperature (-40C° / 150C°)
Burn in oven Mazzali
Qualification
HTOL, HTS
Temperature range
150°C
Temperature test chamber Weiss Technik
Qualification
TC
Temperature range
-60°C + 150°C
Temperature test chamber
Saunder
Qualification
TC
Temperature range
-50 to 150°C
Temperature and humidity test chamber Mazzali
Qualification
THB
Temperature range
85°C / 85% HR
Pressure cooker chamber Tabal
Qualification
AC
Temperature range
130°C / 100% HR
Thermostream
ATS710MII
Qualification
Screening
Temperature range
-70°C + 225°C
Electroglas 2001X
Wafer size
4-6 inch
Temperature
amb / hot
(room to 120°C)
Electroglas 2080
Wafer size
4-6-8 inch
Temperature
amb / hot
(room to 120°C)
Electroglas
4090u
Wafer size
5-6-8 inch
Temperature
cold / amb / hot
(-40 to 150°C)
Accretech
UF3000EX-e
Wafer size
8-12 inch
Temperature
cold / amb / hot
(-40 to 200°C)
Option
dark fixture
LTX / Credence D10
Type
mixed signal tester
DPS
DPIN (digital): 96 I/O x2
VIS
VIS (analog): 16 channels x2
Credence STS / KTS
Type
digital tester
STS6500
60 pins
KTS6060 / KTS6500 / KTS6120
60 pins (sparc station)
STI TR18AS2
Packages
SO-150, SO-300, SSOP, TSSOP, MSOP, QFN 5×5
ISMECA 4000
Packages
Manual handling
V-Tek TM-50
Packages
Manual handling
AATEC LISA
Packages
Vibrating bowl to reel, tube to reel, tray to reel
MT8704iHF
Temperature
amb / hot
(room to 120°C)
EX5000 + Tape&Reel
Temperature
amb
Rasco1000
Temperature
cold/ amb / hot
(-50 to 150°C)
MH250
Temperature
cold/ amb / hot
(-40 to 85°C)