Semiconductor Packaging

Providing first class packaging and housing

IC packaging

Semiconductor Packaging

Aptasic offers a large panel of packaging solutions from low volume to mass production. Including, from bare die assembly (as WLCSP) ,  through open cavity packages to high volume QFN.

Standard semiconductor packaging

Packages for prototyping

Open package families

Plastic open cavity packages: DFN, QFN, TQFP, LQFP, SOICN, SOIC-W, SSOP

Packages for Mass Production

Laminate substrate packages

JLCC, LCC, LDCC, QFP, PDIP, PGA, TO, SOIC

Discrete package families

SOT-23, SOTI43, SC70, TSOT, SOT666, SOT223, TO-92, SOT89, SOT323

Ceramic packages

JLCC, LCC, LDCC, QFP, PDIP, PGA, TO, SOIC

Standard package families

Lead-less packages: DFN, QFN Leaded packages: QFP, TQFP, LQFP, MSOP, QSOP, SOICN, SOIC-W, TSSOP-4.4, TSSOP-6.1, SSOP PDIP, PLCC

Specific packages

TO-220, DDPACK, Clear pkgs, PSOP

Multi die packages

Stacked, Flip, chipped, Multi chips System in Package (SIP) wiht Chips and passive components. Package on / in package

Wafer Level Chip Scale (WLCS)

Specific custom package development

  • Wafer Level Chip Scale Packages (WLCSP) with servie like RDL, re-passivation and various types of bumps
  • Wafer molding process services
  • PCBA and COB modules
  • Single services like: back-grinding, sawing, Tape&Reel, visual inspection

Wafer Level Package

  • Wafer inspection
  • RDL Redistributio
  • UBM Under Bump Metallization
  • Bumping

Wafer Level Test

  • Wafer level probing
  • Cantilever or vertical probing
  • Wafer sort

Back-end and conditioning

  • Back grinding
  • Laser marking (optional)
  • Wafer singulation , sawing
  • Tape & Reel, waffle pack or wafer on blue tape
  • AOI (automatic inspection)

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