Wafer probing package test and screening

Test program development: analog/mixed signal (AMS), digital scan test, memory BIST, radio frequency (RF)

Cantilever or vertical wafer probing

Single site or Multi-site wafer probing at cold/room/hot temperature (-40C / 150C)

Parallel package test at cold/room/hot temperature (-40C / 150C)

Full range of qualification procedures accordingly to JEDEC / MIL-883