Package from prototyping to mass production

qfn

Open package families

Plastic open cavity packages: DFN, QFN, TQFP, LQFP, SOIC-N, SOIC-W, SSOP.

Ceramic packages

JLCC, LCC, LDCC, QFP, PDIP, PGA,TO, SOIC.

ceram

Standard package families

Lead-less packages : DFN, QFN.

Leaded packages : QFP, TQFP*, LQFP*, MSOP, QSOP, SOIC-N, SOIC-W, TSSOP-4.4, TSSOP-6.1, SSOP PDIP, PLCC*.

 

std qfn pack

Laminate substrate  packages

BGA, LGA.

Discrete package families

SOT-23, SOT143, SC70, TSOT, SOT666, SOT223, TO-92, SOT89, SOT323.

Specific package

TO-220, DDPACK, Clear pkgs, PSOP.

Multi die packages

Stacked, Flip chipped, Multi chips.System in Package (SIP) with Chips and passive components.Package on/in package.

Specific custom package development

Wafer Level Ship Scale Packages (WLCSP) with services like RDL, re-passivation and various types of bumps.

Wafer molding process services.

PCBA and COB modules.

Single services like: back-grinding, sawing, tape and reel, visual inspection.