Semiconductor packaging

Providing first class semiconductor packaging and housing

Aptasic - Semiconductor Packaging

Semiconductor packaging

Semiconductor industry

Aptasic offers a large panel of semiconductor packaging solutions in low volume and mass production. From bare die assembly (WLCSP), to open cavity packages to high volume QFN.

Packages for Prototyping

Open package families
Plastic open cavity packages: DFN, QFN, TQFP, LQFP, SOICN, SOIC-W, SSOP

Packages for Mass Production

Laminate substrate packages
JLCC, LCC, LDCC, QFP, PDIP, PGA, TO, SOIC

Discrete package families
SOT-23, SOTI43, SC70, TSOT, SOT666, SOT223, TO-92, SOT89, SOT323

Ceramic packages
JLCC, LCC, LDCC, QFP, PDIP, PGA, TO, SOIC

Standard package families
Lead-less packages: DFN, QFN Leaded packages: QFP, TQFP, LQFP, MSOP, QSOP, SOICN, SOIC-W, TSSOP-4.4, TSSOP-6.1, SSOP PDIP, PLCC

Specific packages
TO-220, DDPACK, Clear pkgs, PSOP

Multi die packages
Stacked, Flip, chipped, Multi chips System in Package (SIP) with Chips and passive components. Package on / in package

Wafer Level Chip Scale (WLCS)

Specific custom package development

Wafer Level Package

Wafer Level Test

Back-end and conditioning

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