ASIC Encapsulation

Providing first class packaging and housing

ASIC Encapsulation

Aptasic offers a large panel of packaging solutions from low volume to mass production

From bare die assembly (as WLCSP) ,  thru open cavity packages to high volume QFN.

Packages for prototyping

Open package families

Plastic open cavity packages: DFN, QFN, TQFP, LQFP, SOICN, SOIC-W, SSOP

Packages for Mass Production

Laminate substrate packages

JLCC, LCC, LDCC, QFP, PDIP, PGA, TO, SOIC

Discrete package families

SOT-23, SOTI43, SC70, TSOT, SOT666, SOT223, TO-92, SOT89, SOT323

Ceramic packages

JLCC, LCC, LDCC, QFP, PDIP, PGA, TO, SOIC

Standard package families

Lead-less packages: DFN, QFN

Leaded packages: QFP, TQFP, LQFP, MSOP, QSOP, SOICN, SOIC-W, TSSOP-4.4, TSSOP-6.1, SSOP PDIP, PLCC

Specific packages

TO-220, DDPACK, Clear pkgs, PSOP

Multi die packages

Stacked, Flip, chipped, Multi chips System in Package (SIP) wiht Chips and passive components. Package on / in package

Wafer Level Chip Scale (WLCS)

Specific custom package development

Wafer Level Chip Scale Packages (WLCSP) with servie like RDL, re-passivation and various types of bumps.

Wafer molding process services

PCBA and COB modules

Single services like: back-grinding, sawing, Tape&Reel, visual inspection

Wafer Level Package

Wafer inspection

RDL Redistribution

UBM Under Bump Metallization

Bumping

Wafer Level Test

Wafer level probing

Cantilever or vertical probing

Wafer sort

Back-end and conditioning

Back grinding

Laser marking (optional)

Wafer singulation , sawing

Tape & Reel, waffle pack or wafer on blue tape

AOI (automatic inspection)

Need information ?

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